Press Releases

EDGE and Lockheed Martin to Collaborate on Advanced Chiplet Design Capabilities

18 February 2025
EDGE and Lockheed Martin to Collaborate on Advanced Chiplet Design  Capabilities

EDGE, one of the world’s leading advanced technology and defence groups, signed a Letter of Intent (LOI) with Lockheed Martin to collaborate on localising the design of advanced Chiplet-based processors for single-board computers.

Signed at the International Defence Exhibition & Conference 2025 (IDEX 2025), the LOI is aimed at enhancing the UAE’s competitiveness in the global aerospace and defence market through a ‘Chiplet Ecosystem Programme’. EDGE entity HALCON, a regional leader in the end-to-end manufacturing and production of smart weapon systems, will lead the strategic collaboration with Lockheed Martin to expand, diversify, and localise the UAE’s single-board computer electronics production capabilities.

The ‘Chiplet Ecosystem Programme’ is the latest development from HALCON’s Special Manufacturing Division and will complement the company’s advanced in-house printed circuit board (PCB) assembly facility.

Chiplet-based processors permit enhanced targeting and guidance through more sophisticated onboard computation, enabling advanced algorithms for target acquisition, tracking, and guidance. As high-performance processors, they can also efficiently handle data from multiple sensors simultaneously, providing real-time situational awareness.

Attendees can visit EDGE’s diverse portfolio at indoor stand 05-C20 in hall 5 and outdoor stand CP-270 until 21 February 2025.